We have developed a new type of method of estimating fracture loads using stress intensity factors in IC ceramic packages under complicated load conditions. The right-angle corners in the cross sections of IC ceramic packages were assumed to be wedge cracks, and the fracture criterion was defined as curved surface in ModeⅠ(tensile opening)-ModeⅡ(in-plane shear)-ModeⅢ(tearing) coordinate space.
[ FULL TEXT (pdf) ]