Vol.30 No.2(2) [2008]

Using Stress Intensity Factors in Fracture Load Estimation for IC Ceramic Packages

Masahiro ISHIBASHI and Hideharu NAKASHIMA


We have developed a new type of method of estimating fracture loads using stress intensity factors in IC ceramic packages under complicated load conditions. The right-angle corners in the cross sections of IC ceramic packages were assumed to be wedge cracks, and the fracture criterion was defined as curved surface in ModeⅠ(tensile opening)-ModeⅡ(in-plane shear)-ModeⅢ(tearing) coordinate space.