EVERGREEN

Joint Journal of Novel Carbon Resource Sciences and Green Asia Strategy

ISSN:2189-0420 (Print until Mar 2020)
ISSN:2432-5953 (Online)

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Investigation of the Thermal and Surface Properties of Glass-Carbon Hybrid Fiber Epoxy Composite

Munif Hasin1,*, Sarower Kabir1, M A Gafur2, Adib Bin Rashid3, Muhatasim Mahmud Ridom1
1Mechanical and Production Engineering, Ahsanullah University of Science and Technology, Bangladesh
2Pilot Plant and Process Development Centre, Bangladesh Council of Scientific and Industrial Research, Bangladesh
3Industrial and Production Engineering, Military Institute of Science and Technology, Bangladesh
*Author to whom correspondence should be addressed:
E-mail: munif.hasin.example@university.edu (MH)
Received: August 21, 2024 | Revised: February 03, 2025 | Accepted: April 01, 2025 | Published: June 2025
Abstract
The modern world has seen a rapid surge in the usage of composite materials in recent times for their widespread applications and versatility. This study investigated thermal properties and the surface morphology of carbon and glass fiber-reinforced polymer matrix composite fabricated by vacuum infusion molding (VIM) process. Lee’s and Charlton's method for thermal conductivity of bad conductors proved its poor thermal conductivity, where the value was found 0.52 Wm-1K-1. Coefficient of thermal expansion was measured by Thermomechanical analysis (TMA), which also revealed that the thermal expansion occurred in multiple stages and subsequently resulting in multiple coefficient of thermal expansion. The thermogravimetric analysis disclosed the degradation rate, glass transition temperature, onset temperature, degradation steps, and their possible causes. Scanning electron microscope (SEM) was used to characterize its surface properties which showed the composite’s internal structure. All of the tests displayed promising results in terms of it’s potential in high-temperature applications, such as in the aerospace industry.
Keywords
DTA ; Scanning electron microscope ; Composites ; Thermal conductivity ; TMA ; HFRP ; DTG
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